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 NJT4030P
Preferred Device
Product Preview Bipolar Power Transistors
PNP Silicon
Features http://onsemi.com
* Collector -Emitter Sustaining Voltage - * High DC Current Gain -
hFE VCEO(sus) = 40 Vdc (Min) @ IC = 10 mAdc = 200 (Min) @ IC = 1.0 Adc = 100 (Min) @ IC = 3.0 Adc Low Collector -Emitter Saturation Voltage - VCE(sat) = 0.200 Vdc (Max) @ IC = 1.0 Adc = 0.500 Vdc (Max) @ IC = 3.0 Adc SOT-223 Surface Mount Packaging Epoxy Meets UL 94, V-0 @ 0.125 in ESD Ratings: Human Body Model, 3B; > 8000 V Machine Model, C; > 400 V These are Pb-Free Devices
PNP TRANSISTOR 3.0 AMPERES 40 VOLTS, 2.0 WATTS
C 2,4
* * * * *
B1
E3
Schematic
MARKING DIAGRAM
SOT-223 CASE 318E STYLE 1 1 A Y W 4030P G
AYW 4030PG
= Assembly Location Year = Work Week = Specific Device Code = Pb-Free Package
PIN ASSIGNMENT
4 C
B 1
C 2
E 3
Top View Pinout
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.
(c) Semiconductor Components Industries, LLC, 2006
1
December, 2006 - Rev. P2
Publication Order Number: NJT4030P/D
NJT4030P
II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS (TC = 25C unless otherwise noted)
Rating Symbol VCEO VCB VEB IB Value 40 40 Unit Vdc Vdc Vdc Adc Adc W Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage 6.0 1.0 3.0 5.0 Base Current - Continuous Collector Current - Continuous Collector Current - Peak IC Total Power Dissipation Total PD @ TA = 25C mounted on 1" sq. (645 sq. mm) Collector pad on FR-4 bd material Total PD @ TA = 25C mounted on 0.012" sq. (7.6 sq. mm) Collector pad on FR-4 bd material Operating and Storage Junction Temperature Range PD 2.0 0.80 TJ, Tstg - 55 to + 150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol RqJA RqJA TL
Max 64 155
Unit
Thermal Resistance, Junction-to-Case - Junction-to-Ambient on 1" sq. (645 sq. mm) Collector pad on FR-4 bd material - Junction-to-Ambient on 0.012" sq. (7.6 sq. mm) Collector pad on FR-4 bd material Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 5 seconds
C/W
260
C
ORDERING INFORMATION
Device NJT4030PT1G NJT4030PT3G
Package SOT-223 (Pb-Free) SOT-223 (Pb-Free)
Shipping 1000 / Tape & Reel 4000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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2
PD, POWER DISSIPATION (W)
II III I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I II III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIIIIIIII I III I III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II III I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I II III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I III II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I III III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%. 2. fT = |hFE| * ftest DYNAMIC CHARACTERISTICS ON CHARACTERISTICS (Note 1) OFF CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Current-Gain - Bandwidth Product (Note 2) (IC = 500 mA, VCE = 10 V, Ftest = 1.0 MHz)
Input Capacitance (VEB = 5.0 Vdc, f = 1.0 MHz)
Output Capacitance (VCB = 10 Vdc, f = 1.0 MHz)
DC Current Gain (IC = 0.5 Adc, VCE = 1.0 Vdc) (IC = 1.0 Adc, VCE = 1.0 Vdc) (IC = 3.0 Adc, VCE = 1.0 Vdc)
Base-Emitter On Voltage (IC = 1.0 Adc, VCE = 2.0 Vdc)
Base-Emitter Saturation Voltage (IC = 1.0 Adc, IB = 0.1 Adc)
Collector-Emitter Saturation Voltage (IC = 0.5 Adc, IB = 5.0 mAdc) (IC = 1.0 Adc, IB = 10 mAdc) (IC = 3.0 Adc, IB = 0.3 Adc)
Emitter Cutoff Current (VBE = 6.0 Vdc)
Collector Cutoff Current (VCB = 40 Vdc)
Emitter-Base Voltage (IE = 50 mAdc, IC = 0 Adc)
Collector-Emitter Sustaining Voltage (IC = 10 mAdc, IB = 0 Adc)
Characteristic
0.5
1.0
1.5
2.0
2.5
0 25
50
Figure 1. Power Derating
TC
TA
TJ, TEMPERATURE (C)
http://onsemi.com
75
NJT4030P
3 100 125 VCEO(sus) Symbol VCE(sat) VBE(sat) VBE(on) VEBO ICBO IEBO Cob hFE Cib fT 150 Min 220 200 100 6.0 40 - - - - - - - - - - Typ 160 130 40 - - - - - - - - - - - - 0.150 0.200 0.500 Max - 400 - 100 100 1.0 1.0 - - - - - nAdc nAdc MHz Unit Vdc Vdc Vdc Vdc Vdc pF pF -
NJT4030P
TYPICAL CHARACTERISTICS
600 VCE = 1 V hFE, DC CURRENT GAIN hFE, DC CURRENT GAIN 500 400 25C 300 200 100 0 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A) -40C 150C 600 150C 500 400 25C 300 200 100 0 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A) -40C 700 VCE = 4 V
Figure 2. DC Current Gain
1 VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE (V) 150C 25C 0.1 -40C VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE (V) IC/IB = 10 1 IC/IB = 50
Figure 3. DC Current Gain
150C
25C 0.1
-40C
0.01
0.001 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A)
0.01 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A)
Figure 4. Collector-Emitter Saturation Voltage
1 VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
Figure 5. Collector-Emitter Saturation Voltage
VBE(on), EMITTER-BASE VOLTAGE (V)
VCE = 2 V
IC = 2 A 1A 0.1 0.1 A 0.5 A
-40C
25C
150C
0.01 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 IB, BASE CURRENT (A)
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Figure 6. Collector Saturation Region
Figure 7. VBE(on) Voltage
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4
NJT4030P
TYPICAL CHARACTERISTICS
1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1.2 IC/IB = 10 VBE(sat), EMITTER-BASE SATURATION VOLTAGE (V) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A) -40C IC/IB = 50
VBE(sat), EMITTER-BASE SATURATION VOLTAGE (V)
-40C
25C 150C
25C
150C
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Figure 8. Base-Emitter Saturation Voltage
350 Cobo, OUTPUT CAPACITANCE (pF) Cibo, INPUT CAPACITANCE (pF) 300 250 200 150 100 50 0 0 1 2 3 4 5 6 VEB, EMITTER BASE VOLTAGE (V) TJ = 25C ftest = 1 MHz 100
Figure 9. Base-Emitter Saturation Voltage
80
TJ = 25C ftest = 1 MHz
60
40
20 0 0 5 10 15 20 25 30 35 VCB, COLLECTOR BASE VOLTAGE (V)
Figure 10. Input Capacitance
200 IC, COLLECTOR CURRENT (A) fTau, CURRENT BANDWIDTH PRODUCT (MHz) 180 160 140 120 100 80 60 40 20 0 0.001 0.01 0.1 1 IC, COLLECTOR CURRENT (A) TJ = 25C ftest = 1 MHz VCE = 10 V 10
Figure 11. Output Capacitance
0.5 ms 1 10 ms 100 ms 0.1 1 ms
0.01 1 10 VCE, COLLECTOR-EMITTER VOLTAGE (V) 100
Figure 12. Current-Gain Bandwidth Product
Figure 13. Safe Operating Area
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5
NJT4030P
PACKAGE DIMENSIONS
SOT-223 (TO-261) CASE 318E-04 ISSUE L
D b1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10 - INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 -
4
HE
1
2
3
E
b e1 e q C
DIM A A1 b b1 c D E e e1 L1 HE
A 0.08 (0003) A1
q
MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0
MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0
MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10
L1
SOLDERING FOOTPRINT*
3.8 0.15 2.0 0.079
2.3 0.091
2.3 0.091
6.3 0.248
2.0 0.079 1.5 0.059
mm inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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6
NJT4030P/D


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